Solid-state relays dissipate heat in direct proportion to load current, and their long-term reliability depends on how effectively that heat is removed. As a result, the maximum allowable load current of an SSR is directly tied to the thermal performance of the heat sink used in the application.
For example, a 90 A solid-state relay can carry 90 A of load current only if it is mounted to a heat sink capable of dissipating approximately 90 W of heat in the given ambient environment. If the heat sink cannot safely dissipate that amount of power, the load current must be reduced to prevent the relay from overheating.
In most applications, it is recommended to keep the SSR baseplate temperature below 80 °C, although many devices can operate safely at baseplate temperatures up to 100 °C. If a relay is installed in a 40 °C ambient environment and the baseplate temperature is limited to 80 °C, the allowable temperature rise is 40 °C. To dissipate 90 W of power while staying within this limit, a heat sink with a thermal resistance of 0.44 °C/W or lower is required (40 °C ÷ 90 W).
If the same relay were instead mounted to a 2 °C/W heat sink, the allowable power dissipation would be limited to 20 W (40 °C ÷ 2 °C/W). Assuming a dissipation rate of approximately 1 W per ampere, the maximum allowable load current would be reduced to 20 A.
Without any external heat sink, most AC output solid-state relays can carry only 5 to 7 amps of load current in a 40 °C ambient environment. While the relay baseplate provides some heat dissipation, its effectiveness is limited by size and surface area.
HBControls Power Controllers utilize highly efficient, application-matched heat sinks to safely dissipate this heat during normal operation. Datasheets for each controller specify the maximum allowable load current at a given ambient temperature, eliminating the need for thermal calculations or heat sink selection.